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RF360 - A Qualcomm-TDK joint venture / B30821D2036Q828

B30821D2036Q828

Nimewo Pati Manifakti: B30821D2036Q828
Manifakti: RF360 - A Qualcomm-TDK joint venture
Pati nan Deskripsyon: RX TXRX MODULE SURFACE MOUNT
Estati san plon / Estati RoHS: San Plon / Konfòme RoHS
Kondisyon Stock: Nan stok
Bato Soti nan: Hong Kong
Fason chajman: DHL/Fedex/TNT/UPS/EMS
REMAK
RF360 - A Qualcomm-TDK joint venture B30821D2036Q828 disponib nan chipnets.com. Nou sèlman vann nouvo & orijinal pati epi nou ofri 1 ane garanti tan. Si ou ta renmen konnen plis sou pwodwi yo oswa aplike plis pi bon pri, tanpri kontakte nou klike sou Online Chat la oswa voye yon quote ba nou.
Tout Eelctronics Components yo pral anbalaj trè an sekirite pa ESD pwoteksyon antistatik.

package

Spesifikasyon
Kalite Deskripsyon
Seri-
PakèTray
Pati StatusObsolete
RF Fanmi / Creole-
Pwotokòl-
Modulation-
Frekans-
Done To-
Pouvwa - Sòti-
Sansibilite-
Seri interfaces-
Kalite Antèn-
Itilize IC / Pati-
Gwosè memwa-
Voltage - Pwovizyon pou-
Kouran - Resevwa-
Kouran - transmèt-
Mounting KaliteSurface Mount
Tanperati opere-
Pake / Ka-
ACHTE OPSYON

Estati Stock: Anbake menm jou

Minimòm: 1

Kantite Pri inite Ext. Pri

Rele mwen

Kalkil machandiz

US $ 40 pa FedEx.

Rive nan 3-5 jou

Eksprime: (FEDEX, UPS, DHL, TNT) Livrezon gratis sou premye 0.5kg pou lòd plis pase 150 $, yo pral chaje twò gwo separeman.

Modèl popilè
Product

B30821D2036Q828

RF360 - A Qualcomm-TDK joint venture

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