RF360 - A Qualcomm-TDK joint venture / B30686D5333X932
Imaj se pou referans, tanpri kontakte nou pou jwenn foto reyèl la
B30686D5333X932
| Nimewo Pati Manifakti: | B30686D5333X932 |
| Manifakti: | RF360 - A Qualcomm-TDK joint venture |
| Pati nan Deskripsyon: | RF MODULE DIVERSITY W/LNA |
| Estati san plon / Estati RoHS: | San Plon / Konfòme RoHS |
| Kondisyon Stock: | Nan stok |
| Bato Soti nan: | Hong Kong |
| Fason chajman: | DHL/Fedex/TNT/UPS/EMS |
- REMAK
- RF360 - A Qualcomm-TDK joint venture B30686D5333X932 disponib nan chipnets.com. Nou sèlman vann nouvo & orijinal pati epi nou ofri 1 ane garanti tan. Si ou ta renmen konnen plis sou pwodwi yo oswa aplike plis pi bon pri, tanpri kontakte nou klike sou Online Chat la oswa voye yon quote ba nou.
Tout Eelctronics Components yo pral anbalaj trè an sekirite pa ESD pwoteksyon antistatik.
Spesifikasyon
| Kalite | Deskripsyon |
|---|---|
| Seri | - |
| Pakè | Bulk |
| Pati Status | Obsolete |
| RF Fanmi / Creole | - |
| Pwotokòl | - |
| Modulation | - |
| Frekans | - |
| Done To | - |
| Pouvwa - Sòti | - |
| Sansibilite | - |
| Seri interfaces | - |
| Kalite Antèn | - |
| Itilize IC / Pati | - |
| Gwosè memwa | - |
| Voltage - Pwovizyon pou | - |
| Kouran - Resevwa | - |
| Kouran - transmèt | - |
| Mounting Kalite | - |
| Tanperati opere | - |
| Pake / Ka | - |
Estati Stock: Anbake menm jou
Minimòm: 1
| Kantite | Pri inite | Ext. Pri |
|---|---|---|
|
Rele mwen |
||
Kalkil machandiz
US $ 40 pa FedEx.
Rive nan 3-5 jou
Eksprime: (FEDEX, UPS, DHL, TNT) Livrezon gratis sou premye 0.5kg pou lòd plis pase 150 $, yo pral chaje twò gwo separeman.
Modèl popilè
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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