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RF360 - A Qualcomm-TDK joint venture / B39000E1072X938

Imaj se pou referans, tanpri kontakte nou pou jwenn foto reyèl la

B39000E1072X938

Nimewo Pati Manifakti: B39000E1072X938
Manifakti: RF360 - A Qualcomm-TDK joint venture
Pati nan Deskripsyon: FILTER SAW
Estati san plon / Estati RoHS: San Plon / Konfòme RoHS
Kondisyon Stock: Nan stok
Bato Soti nan: Hong Kong
Fason chajman: DHL/Fedex/TNT/UPS/EMS
REMAK
RF360 - A Qualcomm-TDK joint venture B39000E1072X938 disponib nan chipnets.com. Nou sèlman vann nouvo & orijinal pati epi nou ofri 1 ane garanti tan. Si ou ta renmen konnen plis sou pwodwi yo oswa aplike plis pi bon pri, tanpri kontakte nou klike sou Online Chat la oswa voye yon quote ba nou.
Tout Eelctronics Components yo pral anbalaj trè an sekirite pa ESD pwoteksyon antistatik.

package

Spesifikasyon
Kalite Deskripsyon
Seri*
PakèTape & Reel (TR)
Pati StatusActive
Frekans - Sant-
Pleasant-
Pèt ensèsyon-
Evalyasyon-
Aplikasyon-
Mounting Kalite-
Pake / Ka-
Wotè (Max)-
Gwosè / dimansyon-
ACHTE OPSYON

Estati Stock: 4000

Minimòm: 1

Kantite Pri inite Ext. Pri
  • 1: $3.99000
Kalkil machandiz

US $ 40 pa FedEx.

Rive nan 3-5 jou

Eksprime: (FEDEX, UPS, DHL, TNT) Livrezon gratis sou premye 0.5kg pou lòd plis pase 150 $, yo pral chaje twò gwo separeman.

Modèl popilè
Product

B39000E1073X938

RF360 - A Qualcomm-TDK joint venture
Product

B39000E1072X938

RF360 - A Qualcomm-TDK joint venture
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