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Panduit Corporation / HB1P6-X

Imaj se pou referans, tanpri kontakte nou pou jwenn foto reyèl la

HB1P6-X

Nimewo Pati Manifakti: HB1P6-X
Manifakti: Panduit Corporation
Pati nan Deskripsyon: HARNESS BOARD PLATFORM 6 HIGH 1
Fichye done yo: HB1P6-X Fichye done yo
Estati san plon / Estati RoHS: San Plon / Konfòme RoHS
Kondisyon Stock: Nan stok
Bato Soti nan: Hong Kong
Fason chajman: DHL/Fedex/TNT/UPS/EMS
REMAK
Panduit Corporation HB1P6-X disponib nan chipnets.com. Nou sèlman vann nouvo & orijinal pati epi nou ofri 1 ane garanti tan. Si ou ta renmen konnen plis sou pwodwi yo oswa aplike plis pi bon pri, tanpri kontakte nou klike sou Online Chat la oswa voye yon quote ba nou.
Tout Eelctronics Components yo pral anbalaj trè an sekirite pa ESD pwoteksyon antistatik.

package

Spesifikasyon
Kalite Deskripsyon
Seri-
PakèBulk
Pati StatusObsolete
Kalite akseswaHarness Board Platform
Pou itilize ak / Pwodwi ki gen rapòHarness Boards and Accessories
MateryèlPolyamide (PA), Nylon
KarakteristikWire Bundle Diameter - 1.00" (25.40mm)
ACHTE OPSYON

Estati Stock: Anbake menm jou

Minimòm: 1

Kantite Pri inite Ext. Pri

Rele mwen
Kalkil machandiz

US $ 40 pa FedEx.

Rive nan 3-5 jou

Eksprime: (FEDEX, UPS, DHL, TNT) Livrezon gratis sou premye 0.5kg pou lòd plis pase 150 $, yo pral chaje twò gwo separeman.

Modèl popilè
Product

HB1P6-X

Panduit Corporation
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