67SLG050060050PI00

Nimewo Pati Manifakti:	67SLG050060050PI00
Manifakti:	Laird - Performance Materials
Pati nan Deskripsyon:	METAL FILM OVER FOAM CONTACTS
Fichye done yo:	67SLG050060050PI00 Fichye done yo
Estati san plon / Estati RoHS:	San Plon / Konfòme RoHS
Kondisyon Stock:	Nan stok
Bato Soti nan:	Hong Kong
Fason chajman:	DHL/Fedex/TNT/UPS/EMS

REMAK: Laird - Performance Materials 67SLG050060050PI00 disponib nan chipnets.com. Nou sèlman vann nouvo & orijinal pati epi nou ofri 1 ane garanti tan. Si ou ta renmen konnen plis sou pwodwi yo oswa aplike plis pi bon pri, tanpri kontakte nou klike sou Online Chat la oswa voye yon quote ba nou.

Tout Eelctronics Components yo pral anbalaj trè an sekirite pa ESD pwoteksyon antistatik.

package

Spesifikasyon

Kalite	Deskripsyon
Seri	SMD Grounding Metallized
Pakè	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Pati Status	Active
Kalite	Film Over Foam
Fòm	Rectangle
Lajè	0.197" (5.00mm)
Longè	0.197" (5.00mm)
Wotè	0.236" (6.00mm)
Materyèl	Polyurethane Foam, Tin-Copper Polyester (SN/CU)
PLATING	-
PLATING - Epesè	-
Atachman Metòd	Solder
Tanperati opere	-40°C ~ 70°C

ACHTE OPSYON

Estati Stock: 10763

Minimòm: 1

Kantite	Pri inite	Ext. Pri
1: $0.49000 850: $0.24253 1700: $0.21701

Kalkil machandiz

US $ 40 pa FedEx.

Rive nan 3-5 jou

Eksprime: (FEDEX, UPS, DHL, TNT) Livrezon gratis sou premye 0.5kg pou lòd plis pase 150 $, yo pral chaje twò gwo separeman.

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