HMC-C007

Nimewo Pati Manifakti:	HMC-C007
Manifakti:	Linear Technology (Analog Devices, Inc.)
Pati nan Deskripsyon:	INGAP HBT DIVIDE-BY-8 MODULE 0.5
Fichye done yo:	HMC-C007 Fichye done yo
Estati san plon / Estati RoHS:	San Plon / Konfòme RoHS
Kondisyon Stock:	Nan stok
Bato Soti nan:	Hong Kong
Fason chajman:	DHL/Fedex/TNT/UPS/EMS

REMAK: Linear Technology (Analog Devices, Inc.) HMC-C007 disponib nan chipnets.com. Nou sèlman vann nouvo & orijinal pati epi nou ofri 1 ane garanti tan. Si ou ta renmen konnen plis sou pwodwi yo oswa aplike plis pi bon pri, tanpri kontakte nou klike sou Online Chat la oswa voye yon quote ba nou.

Tout Eelctronics Components yo pral anbalaj trè an sekirite pa ESD pwoteksyon antistatik.

package

Spesifikasyon

ACHTE OPSYON

Estati Stock: Anbake menm jou

Minimòm: 1

Kantite	Pri inite	Ext. Pri
1: $2026.08000

Kalkil machandiz

US $ 40 pa FedEx.

Rive nan 3-5 jou

Eksprime: (FEDEX, UPS, DHL, TNT) Livrezon gratis sou premye 0.5kg pou lòd plis pase 150 $, yo pral chaje twò gwo separeman.

Modèl popilè

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	HMC-C032 Linear Technology (Analog Devices, Inc.)
	HMC-C034 Linear Technology (Analog Devices, Inc.)
	HMC-C033 Linear Technology (Analog Devices, Inc.)

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