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RF360 - A Qualcomm-TDK joint venture / B39921B4379P810

B39921B4379P810

Nimewo Pati Manifakti: B39921B4379P810
Manifakti: RF360 - A Qualcomm-TDK joint venture
Pati nan Deskripsyon: CSSP3 CU
Fichye done yo: B39921B4379P810 Fichye done yo
Estati san plon / Estati RoHS: San Plon / Konfòme RoHS
Kondisyon Stock: Nan stok
Bato Soti nan: Hong Kong
Fason chajman: DHL/Fedex/TNT/UPS/EMS
REMAK
RF360 - A Qualcomm-TDK joint venture B39921B4379P810 disponib nan chipnets.com. Nou sèlman vann nouvo & orijinal pati epi nou ofri 1 ane garanti tan. Si ou ta renmen konnen plis sou pwodwi yo oswa aplike plis pi bon pri, tanpri kontakte nou klike sou Online Chat la oswa voye yon quote ba nou.
Tout Eelctronics Components yo pral anbalaj trè an sekirite pa ESD pwoteksyon antistatik.

package

Spesifikasyon
Kalite Deskripsyon
SeriB4379
PakèTape & Reel (TR)Cut Tape (CT)Digi-Reel®
Pati StatusActive
Frekans - Sant915MHz
Pleasant-
Pèt ensèsyon1.9dB
EvalyasyonAEC-Q200
AplikasyonRemote Control
Mounting KaliteSurface Mount
Pake / Ka5-SMD, No Lead
Wotè (Max)0.018" (0.45mm)
Gwosè / dimansyon0.043" L x 0.035" W (1.10mm x 0.90mm)
ACHTE OPSYON

Estati Stock: 12374

Minimòm: 1

Kantite Pri inite Ext. Pri
  • 1: $0.93000
  • 600000: $0.76570
Kalkil machandiz

US $ 40 pa FedEx.

Rive nan 3-5 jou

Eksprime: (FEDEX, UPS, DHL, TNT) Livrezon gratis sou premye 0.5kg pou lòd plis pase 150 $, yo pral chaje twò gwo separeman.

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