B39162B2611P810

Nimewo Pati Manifakti:	B39162B2611P810
Manifakti:	RF360 - A Qualcomm-TDK joint venture
Pati nan Deskripsyon:	SAW INDUSTRIAL
Fichye done yo:	B39162B2611P810 Fichye done yo
Estati san plon / Estati RoHS:	San Plon / Konfòme RoHS
Kondisyon Stock:	Nan stok
Bato Soti nan:	Hong Kong
Fason chajman:	DHL/Fedex/TNT/UPS/EMS

REMAK: RF360 - A Qualcomm-TDK joint venture B39162B2611P810 disponib nan chipnets.com. Nou sèlman vann nouvo & orijinal pati epi nou ofri 1 ane garanti tan. Si ou ta renmen konnen plis sou pwodwi yo oswa aplike plis pi bon pri, tanpri kontakte nou klike sou Online Chat la oswa voye yon quote ba nou.

Tout Eelctronics Components yo pral anbalaj trè an sekirite pa ESD pwoteksyon antistatik.

package

Spesifikasyon

Kalite	Deskripsyon
Seri	*
Pakè	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Pati Status	Active
Frekans - Sant	1.58247GHz
Pleasant	46.8MHz
Pèt ensèsyon	0.9dB
Evalyasyon	AEC-Q200
Aplikasyon	GPS
Mounting Kalite	Surface Mount
Pake / Ka	5-SMD, No Lead
Wotè (Max)	0.018" (0.45mm)
Gwosè / dimansyon	0.043" L x 0.035" W (1.10mm x 0.90mm)

ACHTE OPSYON

Estati Stock: 18901

Minimòm: 1

Kantite	Pri inite	Ext. Pri
1: $1.08000

Kalkil machandiz

US $ 40 pa FedEx.

Rive nan 3-5 jou

Eksprime: (FEDEX, UPS, DHL, TNT) Livrezon gratis sou premye 0.5kg pou lòd plis pase 150 $, yo pral chaje twò gwo separeman.

Modèl popilè

	B39182B4328P810 RF360 - A Qualcomm-TDK joint venture
	B39132B1642U810 RF360 - A Qualcomm-TDK joint venture
	B39162B1649B510W3 RF360 - A Qualcomm-TDK joint venture
	B39172B5364U410 RF360 - A Qualcomm-TDK joint venture
	B39162B7840C710A3 RF360 - A Qualcomm-TDK joint venture
	B39171B3882Z710W3 RF360 - A Qualcomm-TDK joint venture
	B39162B4058U510V9 RF360 - A Qualcomm-TDK joint venture
	B39182B4235H910 RF360 - A Qualcomm-TDK joint venture
	B39162B4300F210 RF360 - A Qualcomm-TDK joint venture
	B39182B4133U510 RF360 - A Qualcomm-TDK joint venture

Atik sa a te ajoute nan kabwa ou a.