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RF360 - A Qualcomm-TDK joint venture / B39000Z3410A004

B39000Z3410A004

Nimewo Pati Manifakti: B39000Z3410A004
Manifakti: RF360 - A Qualcomm-TDK joint venture
Pati nan Deskripsyon: SAMPLE KIT FOR WIRELESS AMI
Estati san plon / Estati RoHS: San Plon / Konfòme RoHS
Kondisyon Stock: Nan stok
Bato Soti nan: Hong Kong
Fason chajman: DHL/Fedex/TNT/UPS/EMS
REMAK
RF360 - A Qualcomm-TDK joint venture B39000Z3410A004 disponib nan chipnets.com. Nou sèlman vann nouvo & orijinal pati epi nou ofri 1 ane garanti tan. Si ou ta renmen konnen plis sou pwodwi yo oswa aplike plis pi bon pri, tanpri kontakte nou klike sou Online Chat la oswa voye yon quote ba nou.
Tout Eelctronics Components yo pral anbalaj trè an sekirite pa ESD pwoteksyon antistatik.

package

Spesifikasyon
Kalite Deskripsyon
Seri-
PakèPlastic Box with Bin Guide
Pati StatusActive
Kalite TwousResonators, Saw Filters
KantiteAssorted
Mounting KaliteSurface Mount
Pakè Enkli-
Karakteristik-
ACHTE OPSYON

Estati Stock: 2

Minimòm: 1

Kantite Pri inite Ext. Pri
  • 1: $46.50000
  • 10: $45.00000
  • 25: $43.50000
Kalkil machandiz

US $ 40 pa FedEx.

Rive nan 3-5 jou

Eksprime: (FEDEX, UPS, DHL, TNT) Livrezon gratis sou premye 0.5kg pou lòd plis pase 150 $, yo pral chaje twò gwo separeman.

Modèl popilè
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B39000Z3410A004

RF360 - A Qualcomm-TDK joint venture

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B39000Z3410A003

RF360 - A Qualcomm-TDK joint venture

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B39000Z3410A002

RF360 - A Qualcomm-TDK joint venture

Product

B39000Z3410A001

RF360 - A Qualcomm-TDK joint venture

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