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Panduit Corporation / CFFPA2IG

CFFPA2IG

Nimewo Pati Manifakti: CFFPA2IG
Manifakti: Panduit Corporation
Pati nan Deskripsyon: FURNITURE FACEPLATE, 2 PORT, ANG
Estati san plon / Estati RoHS: San Plon / Konfòme RoHS
Kondisyon Stock: Nan stok
Bato Soti nan: Hong Kong
Fason chajman: DHL/Fedex/TNT/UPS/EMS
REMAK
Panduit Corporation CFFPA2IG disponib nan chipnets.com. Nou sèlman vann nouvo & orijinal pati epi nou ofri 1 ane garanti tan. Si ou ta renmen konnen plis sou pwodwi yo oswa aplike plis pi bon pri, tanpri kontakte nou klike sou Online Chat la oswa voye yon quote ba nou.
Tout Eelctronics Components yo pral anbalaj trè an sekirite pa ESD pwoteksyon antistatik.

package

Spesifikasyon
Kalite Deskripsyon
SeriMini-Com®
PakèBulk
Pati StatusObsolete
StyleSingle Gang
KaliteModular Faceplate
Kantite pò2
Pò DireksyonAngled/Sloped
KoulèGray
KarakteristikAdhesive, Label Cover/Holder with Labels
Pou itilize ak / Pwodwi ki gen rapòMini-Com® Series (Flat, Sloped, Sloped Recessed or Blank)
Longè1.700" (43.18mm)
Lajè2.900" (73.66mm)
Pwofondè0.760" (19.30mm)
MateryèlAcrylonitrile Butadiene Styrene (ABS)
Rating enflamabilite materyèl-
ACHTE OPSYON

Estati Stock: 37

Minimòm: 1

Kantite Pri inite Ext. Pri
  • 1: $4.92000
  • 10: $4.78353
  • 25: $4.65090
Kalkil machandiz

US $ 40 pa FedEx.

Rive nan 3-5 jou

Eksprime: (FEDEX, UPS, DHL, TNT) Livrezon gratis sou premye 0.5kg pou lòd plis pase 150 $, yo pral chaje twò gwo separeman.

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