3M / 228-1371-00-0602J
Imaj se pou referans, tanpri kontakte nou pou jwenn foto reyèl la
228-1371-00-0602J
| Nimewo Pati Manifakti: | 228-1371-00-0602J |
| Manifakti: | 3M |
| Pati nan Deskripsyon: | CONN IC DIP SOCKET ZIF 28POS GLD |
| Fichye done yo: | 228-1371-00-0602J Fichye done yo |
| Estati san plon / Estati RoHS: | San Plon / Konfòme RoHS |
| Kondisyon Stock: | Nan stok |
| Bato Soti nan: | Hong Kong |
| Fason chajman: | DHL/Fedex/TNT/UPS/EMS |
- REMAK
- 3M 228-1371-00-0602J disponib nan chipnets.com. Nou sèlman vann nouvo & orijinal pati epi nou ofri 1 ane garanti tan. Si ou ta renmen konnen plis sou pwodwi yo oswa aplike plis pi bon pri, tanpri kontakte nou klike sou Online Chat la oswa voye yon quote ba nou.
Tout Eelctronics Components yo pral anbalaj trè an sekirite pa ESD pwoteksyon antistatik.
Spesifikasyon
| Kalite | Deskripsyon |
|---|---|
| Seri | Textool™ |
| Pakè | Tray |
| Pati Status | Active |
| Kalite | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Kantite pozisyon oswa broch (gri) | 28 (2 x 14) |
| Goudwon - kwazman | 0.100" (2.54mm) |
| Kontakte Fini - kwazman | Gold |
| Kontakte Fini epesè - kwazman | 30.0µin (0.76µm) |
| Kontakte materyèl - kwazman | Beryllium Copper |
| Mounting Kalite | Connector |
| Karakteristik | Closed Frame |
| Revokasyon | Press-Fit |
| Ton - Post | 0.100" (2.54mm) |
| Kontakte Fini - Post | Gold |
| Kontakte Fini Epesè - Post | 30.0µin (0.76µm) |
| Kontakte Materyèl - Post | Beryllium Copper |
| Materyèl Lojman | Polysulfone (PSU), Glass Filled |
| Tanperati opere | -55°C ~ 125°C |
Estati Stock: 34
Minimòm: 1
| Kantite | Pri inite | Ext. Pri |
|---|---|---|
|
||
Kalkil machandiz
US $ 40 pa FedEx.
Rive nan 3-5 jou
Eksprime: (FEDEX, UPS, DHL, TNT) Livrezon gratis sou premye 0.5kg pou lòd plis pase 150 $, yo pral chaje twò gwo separeman.
Modèl popilè
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