RF360 - A Qualcomm-TDK joint venture / B39871R0858H210
Imaj se pou referans, tanpri kontakte nou pou jwenn foto reyèl la
B39871R0858H210
| Nimewo Pati Manifakti: | B39871R0858H210 |
| Manifakti: | RF360 - A Qualcomm-TDK joint venture |
| Pati nan Deskripsyon: | SAW RES 868.3500MHZ SMD |
| Fichye done yo: | B39871R0858H210 Fichye done yo |
| Estati san plon / Estati RoHS: | San Plon / Konfòme RoHS |
| Kondisyon Stock: | Nan stok |
| Bato Soti nan: | Hong Kong |
| Fason chajman: | DHL/Fedex/TNT/UPS/EMS |
- REMAK
- RF360 - A Qualcomm-TDK joint venture B39871R0858H210 disponib nan chipnets.com. Nou sèlman vann nouvo & orijinal pati epi nou ofri 1 ane garanti tan. Si ou ta renmen konnen plis sou pwodwi yo oswa aplike plis pi bon pri, tanpri kontakte nou klike sou Online Chat la oswa voye yon quote ba nou.
Tout Eelctronics Components yo pral anbalaj trè an sekirite pa ESD pwoteksyon antistatik.
Spesifikasyon
| Kalite | Deskripsyon |
|---|---|
| Seri | B39871 |
| Pakè | Tape & Reel (TR)Cut Tape (CT)Digi-Reel® |
| Pati Status | Obsolete |
| Kalite | SAW |
| Frekans | 868.35 MHz |
| Estabilite Frekans | - |
| Tolerans frekans | ±75kHz |
| Karakteristik | - |
| Kapasite | - |
| Enpedans | - |
| Tanperati opere | -40°C ~ 125°C |
| Mounting Kalite | Surface Mount |
| Pake / Ka | 4-SMD, No Lead |
| Gwosè / dimansyon | 0.197" L x 0.138" W (5.00mm x 3.50mm) |
| Wotè | 0.057" (1.45mm) |
Estati Stock: Anbake menm jou
Minimòm: 1
| Kantite | Pri inite | Ext. Pri |
|---|---|---|
|
Rele mwen |
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Kalkil machandiz
US $ 40 pa FedEx.
Rive nan 3-5 jou
Eksprime: (FEDEX, UPS, DHL, TNT) Livrezon gratis sou premye 0.5kg pou lòd plis pase 150 $, yo pral chaje twò gwo separeman.
Modèl popilè
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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RF360 - A Qualcomm-TDK joint venture |
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