+1(337)-398-8111 Live-Chat
RF360 - A Qualcomm-TDK joint venture / B39301R2707U310

B39301R2707U310

Nimewo Pati Manifakti: B39301R2707U310
Manifakti: RF360 - A Qualcomm-TDK joint venture
Pati nan Deskripsyon: SAW RES 303.8250MHZ SMD
Fichye done yo: B39301R2707U310 Fichye done yo
Estati san plon / Estati RoHS: San Plon / Konfòme RoHS
Kondisyon Stock: Nan stok
Bato Soti nan: Hong Kong
Fason chajman: DHL/Fedex/TNT/UPS/EMS
REMAK
RF360 - A Qualcomm-TDK joint venture B39301R2707U310 disponib nan chipnets.com. Nou sèlman vann nouvo & orijinal pati epi nou ofri 1 ane garanti tan. Si ou ta renmen konnen plis sou pwodwi yo oswa aplike plis pi bon pri, tanpri kontakte nou klike sou Online Chat la oswa voye yon quote ba nou.
Tout Eelctronics Components yo pral anbalaj trè an sekirite pa ESD pwoteksyon antistatik.

package

Spesifikasyon
Kalite Deskripsyon
SeriB39301
PakèTape & Reel (TR)Cut Tape (CT)Digi-Reel®
Pati StatusObsolete
KaliteSAW
Frekans303.825 MHz
Estabilite Frekans-
Tolerans frekans-
Karakteristik-
Kapasite-
Enpedans50 Ohms
Tanperati opere-45°C ~ 85°C
Mounting KaliteSurface Mount
Pake / Ka8-SMD, No Lead
Gwosè / dimansyon0.197" L x 0.197" W (5.00mm x 5.00mm)
Wotè0.053" (1.35mm)
ACHTE OPSYON

Estati Stock: Anbake menm jou

Minimòm: 1

Kantite Pri inite Ext. Pri

Rele mwen

Kalkil machandiz

US $ 40 pa FedEx.

Rive nan 3-5 jou

Eksprime: (FEDEX, UPS, DHL, TNT) Livrezon gratis sou premye 0.5kg pou lòd plis pase 150 $, yo pral chaje twò gwo separeman.

Modèl popilè
Product

B39391R0972H110

RF360 - A Qualcomm-TDK joint venture

Product

B39301R807H210

RF360 - A Qualcomm-TDK joint venture

Product

B39311R0994H110

RF360 - A Qualcomm-TDK joint venture

Product

B39301R2707U310

RF360 - A Qualcomm-TDK joint venture

Product

B39351R802H210

RF360 - A Qualcomm-TDK joint venture

Product

B39321R0901H110

RF360 - A Qualcomm-TDK joint venture

Product

B39311R0966H110

RF360 - A Qualcomm-TDK joint venture

Product

B39321R922H110

RF360 - A Qualcomm-TDK joint venture

Product

B39311R884H210

RF360 - A Qualcomm-TDK joint venture

Product

B39321R1921A310

RF360 - A Qualcomm-TDK joint venture

Top